Download Advanced MEMS packaging by John H. Lau ... [et al.] PDF

By John H. Lau ... [et al.]

Creation to MEMS --
Advanced MEMS packaging --
Enabling applied sciences for complex MEMS packaging --
Advanced MEMS wafer-level packaging --
Optical MEMS packaging : communications --
Optical MEMS packaging : bubble swap --
Optical MEMS : microbolometer packaging --
Bio-MEMS packaging --
Biosensor packaging --
Accelerometer packaging --
Radiofrequency MEMS switches --
RF MEMS tunable capacitors and tubable band-pass filters --
Advanced packaging of RF MEMS units

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Extra resources for Advanced MEMS packaging

Example text

D’Camp, Jon B. (Savage, MN), Curtis, Harlan L. (Champlin, MN), Dunaway, Lori A. (New Hope, MN), Glenn, Max C. (Chanhassen, MN), “Methods and apparatus for particle reduction in MEMS devices,” November 20, 2007. Haluzak, Charles C. (Corvallis, OR), Pollard, Jeffrey R. (Corvallis, OR), “MEMS packaging structure and methods,” October 30, 2007. Patel, Satyadev R. (Sunnyvale, CA), Huibers, Andrew G. (Palo Alto, CA), Chiang, Steve S. (Saratoga, CA), “Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates,” October 23, 2007.

2007. 2007. 2007. 2007. 2007. 2007. 2007. 2007. 2007. 2007. 2007. 2007. 2007. 2007. 2007. 2007. 2007. 2007. 2007. 2007. 2006. 2006. 2006. 2006. 2006. 2006. 2006. 2006. 2006. 2006. 2006. 2006. 2006. 2006. 2006. 2006. 2006. 2006. 2006. 2005. 2005. 2005. 2005. 2005. 2005. 2005. 2005. 2005. 2005. 2004. 2004. 2004. 2004. 2004. 2004. 2003. 2003. 2003. 2003. 2002. 2002. 2002. 2002. 2001. 2001. 2001. /Date 1. “Wafer level chip size package for MEMS devices and method for fabricating the same,” Wang, Zhiqi (CN), Yu, Guoqing (CN) (+2), US2009057868 (A1)—2009-03-05.

Los Gatos, CA), Cummings, William J. (Millbrae, CA), Kothari, Manish (Cupertino, CA), Chui, Clarence (San Jose, CA), “Packaging for an interferometric modulator,” October 28, 2008. Zhe, Wang (Singapore, SG), “MEMS microphone with a stacked PCB package and method of producing the same,” October 14, 2008. Hartzell, John Walter (Camas, WA), Zhan, Changqing (Vancouver, WA), Wolfson, Michael Barrett (Somerville, MA), “MEMS pixel sensor,” September 16, 2008. 7 8 Chapter One 7,424,198 7,422,962 7,416,938 7,415,870 7,414,310 7,408,250 7,405,860 7,405,466 7,405,100 7,402,878 Palmateer, Lauren (San Francisco, CA), Cummings, William J.

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